Re: [PATCH vs/3/4/ 00/11] Support cooling device with ID in the OF

[Rafael J. Wysocki]

On Fri, May 29, 2026 at 5:31 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxxxxxxxx> wrote:
>
> On 5/29/26 17:29, Lukasz Luba wrote:
> > Hi Rafael and Daniel,
> >
> > On 5/29/26 13:41, Daniel Lezcano wrote:
> >> On 5/29/26 14:35, Rafael J. Wysocki wrote:
> >>> Hi Daniel,
> >>>
> >>> On Fri, May 29, 2026 at 10:35 AM Daniel Lezcano
> >>> <daniel.lezcano@xxxxxxxxxxxxxxxx> wrote:
> >>>>
> >>>>
> >>>> Hi Rafael,
> >>>>
> >>>> On 5/26/26 16:08, Daniel Lezcano wrote:
> >>>>
> >>>> [ ... ]
> >>>>
> >>>>> ---
> >>>>> Changelog:
> >>>>>    - V4
> >>>>>      - Reworked splitted functions to register a cooling device and
> >>>>>        merged separately
> >>>>
> >>>> Are you fine with the thermal core changes in this series ?
> >>>
> >>> Generally, yes, I am, but let me have one more look at it.
> >>>
> >>>> Is it ok if I pick the series in my branch (and may be send a early
> >>>> PR) ?
> >>>
> >>> I have no comments, I'll respond with an Acked-by to it later today.
> >>>
> >>> Thanks!
> >>
> >> Thanks
> >
> > I have re-ordered the patch 4 <-> 5 and the compilation issue goes away.
> > If you decide to do that feel free to add my tag to the current patch
> > 04/10:
> >
> > Reviewed-by: Lukasz Luba <lukasz.luba@xxxxxxx>
>
> Thanks Lukasz !

So with the change mentioned above by Lukasz, please feel free to add

Acked-by: Rafael J. Wysocki (Intel) <rafael@xxxxxxxxxx>

to the series and take it into your branch.

And yes, an early PR would be welcome.